TAK CHEONG
®
SEMICONDUCTOR
Small Outline Flat Lead Plastic Package
High Speed Switching Diode
Absolute Maximum Ratings
Symbol
P
D
T
STG
T
J
V
R
V
RM
I
FM
I
O
I
FRM
I
FSM
Power Dissipation
T
A
= 25°C unless otherwise noted
Value
200
-65 to +150
+150
80
90
250
150
500
2
Units
mW
°C
°C
V
V
mA
mA
mA
A
Parameter
Storage Temperature Range
Operating Junction Temperature
Reverse Voltage
Repetitive Peak Reverse Voltage
Forward Current
Continuous Forward Current
Repetitive Peak Forward Current
Peak Forward Surge Current
(Pulse Width=1us)
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
High Speed Switching Device (T
RR
<4.0 nS)
General Purpose Diodes
Flat Lead SOD-323 Small Outline Plastic Package
Surface Device Type Mounting
RoHS Compliant
Green EMC
Matte Tin(Sn) Lead Finish
Band Indicates Cathode
DEVICE MARKING CODE:
Device
Device Type
Marking
1SS355
S4
Electrical Characteristics
Symbol
B
V
I
R
V
F
T
RR
Breakdown Voltage
T
A
= 25°C unless otherwise noted
Parameter
Test Condition
I
R
=100µA
V
R
=80V
I
F
=100mA
I
F
=10mA
V
R
=6V
R
L
=100Ω
4
nS
80
100
1.2
Limits
Min
Max
Volts
nA
Volts
Unit
Reverse Leakage Current
Forward Voltage
Reverse Recovery Time
C
Capacitance
V
R
=0.5V, f=1M
HZ
4
pF
Number: DB-010
July 2011 Release, Revision F
Page 1
1SS355
200mW SOD-323 SURFACE MOUNT