TSL238T
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS080E
−
JUNE 2007
MANUFACTURING INFORMATION
The reflow profile specified here describes expected maximum heat exposure of devices during the solder
reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be
limited to one pass through the solder reflow profile.
Table 1. TSL238T Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above T
1
, 217°C
Time above T
2
, 230°C
Time above T
3
, (T
peak
−10°C)
Peak temperature in reflow
Temperature gradient in cooling
t
soak
t
1
t
2
t
3
T
peak
REFERENCE
TSL238T
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max
−5°C/sec
T
peak
Not to scale — for reference only
T
3
T
2
T
1
Temperature (5C)
Time (sec)
t
soak
Figure 12. TSL238T Solder Reflow Profile
t
3
t
2
t
1
The
LUMENOLOGY
r
Company
r
r
Copyright
E
2007, TAOS Inc.
www.taosinc.com
9
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
