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B260 参数 Datasheet PDF下载

B260图片预览
型号: B260
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装肖特基整流器 [SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER]
分类和应用: 二极管光电二极管
文件页数/大小: 2 页 / 1558 K
品牌: TAYCHIPST [ SHENZHEN TAYCHIPST ELECTRONIC CO., LTD ]
 浏览型号B260的Datasheet PDF文件第2页  
B220 THRU B260
2.0A
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
FEATURES
Plastic package has Underwriters Laborator
111
Flammability Classification 94V-0
For surface mounted applications
Low profile package
Built-in strain relief
Metal silicon junction, majority carrier conduction
High surge capability
High current capability,low forward voltage drop
Low power loss,high effciency
For use in low voltage high frequency inverters,free
111
wheeling and polarity protection applications
Guardring for overvoltage protection
o
High temperature soldering guaranteed:250 C/10
1
11
seconds at terminals
MECHANICAL DATA
Case:JEDEC DO-214AA,molded plastic over
1111passivated
chip
Terminals:Solder Plated, solderable per MIL-STD-750,
1111Method
2026
Polarity: Color band denotes cathode end
Weigh t: 0.003 ounces, 0.093
gram
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 100°C
Non-Repetitive Peak Forward Surge Current, 8.3ms single
half sine-wave superimposed on rated load
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Total Capacitance (Note 2)
Typical Thermal Resistance, Junction to Terminal
Typical Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes:
@ T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
C
T
R
qJT
R
qJA
T
j,
T
STG
B220
20
14
B230
30
21
B240
40
28
2.0
50
B250
50
35
B260
60
42
Unit
V
V
A
A
@ I
F
= 2.0A
@ T
A
= 25°C
@ T
A
= 100°C
0.50
0.5
20
200
20
25
-65 to +150
0.70
V
mA
pF
°C/W
°C/W
°C
1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
3. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see
EU Directive Annex Note 7.
E-mail: sales@taychipst.com
1 of 2
Web Site: www.taychipst.com