GS3A THRU GS3M
50V-1000V
SURFACE MOUNT GENERAL PURPOSE RECTIFIERS
3.0A
FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Glass passivated chip junction
MECHANICAL DATA
Case:
JEDEC DO-214AB molded plastic body over passivated chip
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:0.007
ounce, 0.25grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated,
for capacitive load, derate current by 20％)
SYMBOL
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Maximum Average Forward Rectified Current
3/8″lead length at T
L
=75℃
Peak Forward Surge Current 8.3ms single half
sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
current
Maximum DC Reverse Current
Ta =25℃
at rated DC blocking voltage
Ta =125℃
Typical Reverse Recovery Time
(Note 1)
Typical Junction Capacitance
(Note 2)
Typical Thermal Resistance
(Note 3)
Vrrm
Vrms
Vdc
If(av)
Ifsm
Vf
Ir
Trr
Cj
Rth(ja)
Rth(jl)
Rth(jc)
Tstg
GS
3A
50
35
50
GS
3B
100
70
100
GS
3D
200
140
200
GS
3G
400
280
400
3.0
100.0
1.1
5.0
250
2.3
60.0
47.0
13.0
28.0
-50 to +150
GS
3J
600
420
600
GS
3K
800
560
800
GS
3M
1000
700
1000
units
V
V
V
A
A
V
uA
us
pF
℃/W
℃
Storage and Operating Temperature Range
Note：
1. Reverse Recovery Condition If
=0.5A,
Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied voltage of 4.0Vdc
3. Thermal Resistance from junction to ambient and from junction to lead mounted on 8×8mm copper pad area
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Web Site: www.taychipst.com
TAYCHIPST [ SHENZHEN TAYCHIPST ELECTRONIC CO., LTD ]
