%¤)s¢
Ø
Ù
j fe ih
g fe
e
sRfRu u q
u
d s8u(RRq8u
qu2q
¤b`B
µ%
³¯u¬%² «BªB©±µ ¨®¯`°)©¢µ ¨%®¯¤¬ «ªBg´ ' D¦¤ )B%¡ )¤© ¦¤¢
© ¨§ ¥ £ ¢
¤ B'%xB
y wu)g'D 0
uxB)))¤x w))us
xyvy w y vt
yutr p xo
vw%¤sqdn
jmig e l
k%hfd
÷ ð ù ÿ ø ïò ùø ÷ ö ÷ ½ ú ø ôò ü û ð ù óò ø ö õ ð ó ñ ð ï
(ú2)÷ F¤g(¦Aþ(we÷(¦ù ¨6R%2()ú2ð q¤ù (÷¦p#¨ô Fòw2Rî
í á ëæ ç Üæ ç ê é á Ý ç æ Ü å á ä ß Þ ãâ á Ù ß Þ Ü Ú
¦Þ¦!ìgp¨ë FwÝ2è(¤2(Þ !å ¤¤)6(¦à8¤Ý ÛwÙ
p
ei
B4¸
»º¹
)
h gec
f d
r%q
ÃpÂÀ
ÅÄ Á
R#ÇÆ
ÉÈ
¾ %¼
½
Â
BÁ
~%}
|%{
z
Ô¦wÒ
Ó
Ñ
À
%¿
ab`X)W UVS
Y T
··
¤D¶
QR04H
PI
¤ EF
G
ÌË
sÂÊ
¤u ÍÎ
ÐÏ
¾¿
IHH
¨¨G
EF4CA
DB
RQ
¨P
Ø Ö
!× !Õ
½ » º ¹ ¸ · § µ ³ ® ² ±¯ § ¯ ¬ ª « © ¨ §
¼wAª|R´!e¶(¦ ´§ ¨#gb° ¨®2(¤ª R¤b¦
¦( ¤¦ ¤ h¨%¦¦22¤ F(¦R
¥ £ £
¦¢¤bp¦ ¡ (¦% ¨2 )2 2R!( F#(g¢)g(b R2e!R
z
!%~(w!(m nqn(|%¦m Fy Fw2Ag(ops ¨¦%(¦o ¦lk
} { z t x xw v m u tn n r q m p n m
79C A@ 7 6 ! 2¡"2
¡ D)'B1 ¥%B)9 8#©5 ¤43
2 1 ¨ ! " ! § ¨ ¥ £ ¡
%) 0)('& %$# ¡ ©§ ¦¤¢
õ
ÿ þ õ ù õ ü ÷ û ùù ó ø ÷ ö ï ô ò ó ñ ð ï
¢£
ûï
¡
¦¢½ )¤õD%úõ 0)BBõ$¦õ)âàò )¤¢î
í ìÛ D)'Bé %B)æ 8#âàÞ )¤¢Ú
ê åæë ê Ýèç å ä ãá Þß ÝÜÛ
¥4£¤ ¡44 £4 £4
¥ ¥
¡
°¯ ¬ « © ¨ §
WXUVCS £³4±²44®£Fª£4¦
Y T ³
£4£¢ 44 £4 £4
£ £
i
pn j44h d44 44
o
m l g f
k e 8 8
UNITS
£F 4£ £4{ £w 4s
t
| | x x
£44
4
£F ~4£} £4y £u 4q
r
~ z z v v
4
£4 v44t
u
dd
p
Fi4h 4£c
8 w 8q 8e b`
y x s r g f
a
T2£)"2¡ Vpyewx v!6#¤!i2fp)wS v2¤u!¨H (¥ t
x4 £ ¥ G P S §D c C
3!s¨¨$ qD R2RAH2G CF!¨pY
G r§ G C C £ $ W
D G f $
¥(2F!¤#£!¥ D22G(¥(h'2(¦8VR$ ¨$¢¤¨3 D CF(¡ ¨¨W
' $ cD ¡ i
$ ' G ¡ B & § V & $
' ¥ ¥D G V f H d ' $ cD Y S
¦!g!(¡ (¡¦¨e!S¦%2F¤¥b)¦!a U X 29 #8(¥R!¨3 CD & C(¡ ((' ¨X
` Y V W §
B V ¥ & $
£ ' & & C 1 ' & W & C "V
22¡!¥ ¤(¡ ¤¡%¦¥ D!¡ !§8£ (¡¦G AF(¥ U
T Q P I H D ¡ E
!S R!¤%2G CF¤)3 CD & ()A2¡ )9 86#¦12¦)¦¥(' &¨%"#! ¨¢¨¥¦¤¢
C B ¡ " " & @ 7 54 3 $ 0 ¥ '
$
© § £ ¡
E-mail: sales@taychipst.com
& % # ! © §¥
£¥ $ ¡" ¦¤ ¨¦¤
0 @ 9 7 5 3
0 (
(£864(
12)'
FEATURES
LOW FORWARD VOLTAGE DROP
HIGH SWITCHING CAPABILITY
LOW THERMAL RESISTANCE
LOW SWITCHING NOISE
PROPRIETARY
SOFT GLASS
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
Mechanical Data
PARAMETER (TEST CONDITIONS)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
ULTRAFAST RECOVERY DIODES
R
1 of 2
SYMBOL
UFR300
Web Site: www.taychipst.com
50V-1000V
RATINGS
THRU UFR310
3.0A