T
echcode
®
40V, 600mA, 2MHz/1MHz synchronous Buck Converter
DATASHEET
TD1465
Absolute Maximum Ratings
Note1
Symbol
V
IN
V
SW
Parameter
VIN Supply Voltage (VIN to GND)
Pulse Width > 20ns
SW to GND Voltage
Pulse Width < 20ns
EN, FB to GND Voltage
V
BS
V
BS-SW
P
D
T
J
T
STG
T
SDR
BS to GND Voltage
BS to SW Voltage
Power Dissipation
Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature (10 Seconds)
-3 ~ 45
-0.3 ~ 6
V
SW
-0.3 ~ V
SW
+6
-0.3 ~ 6
Internally Limited
150
-65 ~ 150
260
V
V
V
V
W
o
C
o
C
o
C
Rating
-0.3 ~ 45
-1 ~ 45
Unit
V
V
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
JA
Parameter
Junction-to-Ambient Resistance in free air
(Note 2)
SOT-23-6
250
°
C/W
Typical Value
Unit
Note 2:
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operation Conditions
Note3
Symbol
V
IN
V
OUT
I
OUT
Parameter
VIN Supply Voltage
Converter Output Voltage
Continue
Converter Output Current
< 10ms
VOUT/VIN Maximum Ratio
Note 4
TD1465A
TD1465B
VOUT/VIN Minimum Ratio
Note 5
TD1465A
TD1465B
T
A
T
J
Ambient Temperature
Junction Temperature
0 ~ 600
75
65
12
15
-40 ~ 85
-40 ~ 125
mA
%
%
%
%
o
C
o
C
Range
4.5 ~ 40
0.8V ~ 75%V
IN
0 ~ 300
Unit
V
V
mA
Note 3: Refer to the typical application circuit
December, 15, 2012.
Techcode Semiconductor Limited
4
QQ:1929794238
TD [ 美国泰德半导体有限公司 ]
