Features
For surface mounted application
Glass passivated junction chip.
Low forward voltage drop
High current capability
Easy pick and place
High surge current capability
Plastic material used carries Underwriters
Laboratory Classification 94V-0
High temperature soldering:
o
260 C / 10 seconds at terminals
High reliability grade (AEC Q101 qualified)
Mechanical Data
Case: Molded plastic
Terminals: Pure tin plated, lead free
solderable per J-STD-002B and
JESD22-B102D.
Polarity: Indicated by cathode band
Packaging: 12mm tape per EIA STD RS-481
W eight: 0.064 gram
-
-
TDD
-
DAYA
M1 - M7
1.0 AMP. Surface Mount Rectifiers
SMA/DO-214AC
-
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25
o
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol M1
M2
M3
Type Number
Maximum Recurrent Peak Reverse Voltage
50
100 200
V
RRM
Maximum RMS Voltage
35
70
140
V
RMS
Maximum DC Blocking Voltage
50
100 200
V
DC
Maximum Average Forward Rectified
Current @T
L
=110
o
C
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 1.0A
Maximum DC Reverse Current @ T
A
=25
o
C
at Rated DC Blocking Voltage @ T
A
=125
o
C
Typical Reverse Recovery Time (Note 1)
Typical Junction Capacitance ( Note 2 )
Non-Repetitive Peak Reverse Avalanche
Engergy at 25
o
C, I
AS
=1A, L=10mH
Typical Thermal Resistance (Note 3)
M4
400
280
400
1.0
40
1.1
5.0
50
1.5
12
5
M5
600
420
600
M6
800
560
800
M7
Units
1000
V
700
V
1000
V
A
30
A
V
uA
uA
uS
pF
mJ
30
85
o
I
(AV)
I
FSM
V
F
I
R
Trr
Cj
E
AS
R
θJL
R
θJA
Operating Temperature Range
T
J
Storage Temperature Range
T
STG
Notes:
1. Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
2. Measured at 1 MHz and Applied V
R
=4.0 Volts
3. Measured on P.C. Board with 0.2” x 0.2” (5.0mm x 5.0mm) Copper Pad Areas.
27
75
-55 to +150
-55 to +150
C/W
o
o
C
C
- 456 -
TDD [ TDD ]
