73M2901/3.3V
Advanced Single
Chip Modem
December 2000
DESCRIPTION
The 73M2901/3.3V is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem. This device is based on TDK
Semiconductor’s implementation of the industry
standard 8032 microcontroller core with a proprietary
multiply and accumulate (MAC) coprocessor; Sigma-
Delta A/D and D/A converters; and an analog front
end. The ROM and RAM necessary to operate the
modem are contained on the device. Additionally,
the 73M2901/3.3V provides an on-chip oscillator and
Hybrid driver.
The 73M2901/3.3V is a high performance, low
voltage, low power, single chip modem capable of
data transmission and reception through 2400bps.
The 73M2901/3.3V is intended for embedded
applications and battery operation. This device
offers low power 3.3 volt design with optional
internal hybrid and country specific call progress
support.
FEATURES
•
•
•
•
•
•
Low overall system chip count. True one
chip solution for embedded systems
Low operating power (~120mW @ 3.3V,
automatic low power standby and power
down options available)
Internal ROM and RAM for normal operation
On chip optional hybrid driver
Designed for +3.15 through +3.6 volts
Data speeds:
V.22bis – 2400bps
V.22, Bell 212 – 1200bps
V.21, Bell 103 – 300bps
V.23 – 1200/75bps (w/ turnaround (PAVI))
Bell 202 – 1200bps
Bell 202 and V23 4-wire operations
Dynamic Range: -9dBm to –43 dBm
“AT” command set
Host access to modem port pins via AT
commands for custom I/O expansion
DTMF tone generation and detection
Call progress support with multinational
options (FCC68, CTR21, JATE…)
Caller ID capability
Blacklisting capability
Packaging: 32 pin PLCC or 44 pin TQFP
•
•
•
•
•
•
•
•
BLOCK DIAGRAM
RAM
ASRCH
RING
DTR
TxCLK
TxD
RxD
RxCLK
ROM
CPU
AFE
MAC
Hybrid
RxA
TxAP
TxAP
RI
CTS
DCD
DSR
RTS
USR10
USR11
RELAY
HBDEN
TDK [ TDK ELECTRONICS ]
