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OSCILLATING FREQUENCY-TEMPERATURE
CHARACTERISTIC MEASURING CIRCUIT
MUC8/MXC8 TYPE 4.0 to 9.99MHz
Vcc
Fosc
Rf
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Oscillating frequency change: Within ±0.25%
(2) Resonant resistance change: Within ±10Ω
(3) Appearance; serious abnormalities not to exist.
Test items
Low temperature storage
High temperature storage
Test conditions
Temperature: –40±3°C
Time: 1000h
Temperature: +85±2°C
Time: 1000h
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 1000h
–40°C (30min), 85°C (30min) x 100 cycles
Solder temperature: peak 260°C, 10s
reflow
Drop 3 times onto the concrete from a
height of 1m
Frequency: 10
⇔
55
⇔
10Hz/min
Amplitude: 1.5mm
X, Y and Z directions for 2h each
Solder this product onto a glass epoxy
board (L100× W40× T1.6mm), press it by
up to 1mm in 1mm/s and keep it for 5sec.
Vcc: 5V
Rf: 1MΩ
IC: TC4089UBP(TOSHIBA)
Loading humidity resistance
Thermal shock
MXC8 TYPE 10.0 to 11.0MHz
Vcc
Fosc
Soldering heat resistance
Drop
Vibration
Rd
Rf
Board bend test
Vcc: 5V
Rf: 1MΩ
IC: TC74HCU04(TOSHIBA)
Rd: 220Ω
MXC7 TYPE 16.0 to 50.0MHz
Vcc
Fosc
Rf
Vcc: 5V
Rf: 1MΩ
IC: TC74HCU04(TOSHIBA)
MX7 TYPE 16.0 to 50.0MHz
Vcc
Fosc
Rf
Vcc: 5V
Rf: 1MΩ
IC: TC74HCU04 (TOSHIBA)
MYC7 TYPE 24.0 to 50.0MHz
Vcc
Fosc
Rd
Vcc: 5V
Rf: 1MΩ
IC: TC74HCU04(TOSHIBA)
Rd: 680Ω
Rf
• All specifications are subject to change without notice.
004-04 / 20090305 / ef31_ccr.fm
TDK [ TDK ELECTRONICS ]
