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MCZ1210AD102T 参数 Datasheet PDF下载

MCZ1210AD102T图片预览
型号: MCZ1210AD102T
PDF下载: 下载PDF文件 查看货源
内容描述: 片式磁珠(贴片阵列)对于USB1.1音频信号线 [Chip Beads(SMD Array) For Audio USB1.1 Signal Line]
分类和应用: 数据线路滤波器过滤器
文件页数/大小: 3 页 / 55 K
品牌: TDK [ TDK ELECTRONICS ]
 浏览型号MCZ1210AD102T的Datasheet PDF文件第2页浏览型号MCZ1210AD102T的Datasheet PDF文件第3页  
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Chip Beads(SMD Array)
For Audio / USB1.1 Signal Line
MCZ Series MCZ1210-D Type(2-Line)
This is a common type bead product that removes the noise com-
ponents in a signal line and includes beads for two lines in a single
chip. The product exhibits substantial impedance characteristics in
the high frequency range and is therefore capable of effectively
removing differential mode noises. Additionally, an appropriate
amount of magnetic coupling is created between the beads of the
two lines, giving the product the capability to remove not only dif-
ferential mode noise but common mode noise as well. It is
encased in a 1210 casing. This is an SMD product that allows for
automatic mounting by taping.
FEATURES
• Compact size, Low Rdc (0.75Ω max.)
• Capable of removing both common and differential mode noises.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
APPLICATIONS
Audio signal lines used in cell phones and mobile audio devices,
personal computers and peripheral equipment, PDA, digital cam-
era, etc.
PRODUCT IDENTIFICATION
MCZ 1210 A D 102 T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Ferrite material
(4) Number of line
(5) Impedance
102:1000Ω at 100MHz
(6) Packaging style
T:Taping
TEMPERATURE RANGES
Operating/Storage
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.25±0.15
4
3
1.0±0.15
0.35 to 0.40
0.5
1
2
T
0.65±0.15
T
0.5±0.10
0.85±0.15
0.3
Dimensions in mm
CIRCUIT DIAGRAM
4
3
1
2
• No polarity
–40 to +85°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
003-03 / 20061022 / e9421_mcz1210.fm
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