(5/6)
MLG Series MLG1005M Type (For Wireless LAN & Bluetooh)
FEATURES
• Nominal inductance values are supported from 0.6 to 5.6nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
The most suitable in high frequency circuit of 2.4GHz and 5GHz
wireless LAN & Bluetooh.
SHAPES AND DIMENSIONS
1.0±0.05
PRODUCT IDENTIFICATION
MLG 1005 M 2N2 B T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1005
1.0× 0.5mm(L× W)
(3) Material code
(4) Inductance value
2N2
5N6
2.2nH
5.6nH
(5) Inductance tolerance
B
±0.1nH
0.5±0.05
(6) Packaging style
T
Taping (reel)
0.25±0.1
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
0.5±0.05
PACKAGING STYLE AND QUANTITIES
Weight: 1mg
Packaging style
Taping
Quantity
15000 pieces/reel
RECOMMENDED PC BOARD PATTERN
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
0.4 to 0.6
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
TDK [ TDK ELECTRONICS ]
