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MLG1005SR22JT 参数 Datasheet PDF下载

MLG1005SR22JT图片预览
型号: MLG1005SR22JT
PDF下载: 下载PDF文件 查看货源
内容描述: SMD电感器(线圈),高频(多层) [SMD Inductors(Coils) For High Frequency(Multilayer)]
分类和应用: 电感器
文件页数/大小: 6 页 / 78 K
品牌: TDK [ TDK ELECTRONICS ]
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(1/6)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG1005S Type
FEATURES
• Nominal inductance values are supported from 0.3 to 390nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
1.0±0.05
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 1005 S 2N2 S T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1005
1.0× 0.5mm (L× W)
(3) Material code
(4) Inductance value
2N2
12N
R10
2.2nH
12nH
100nH
(5) Inductance tolerance
B
C
S
H
J
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
0.5±0.05
(6) Packaging style
0.25±0.1
T
Taping (reel)
SPECIFICATIONS
0.5±0.05
Operating temperature range
Storage temperature range
Weight: 1mg
–55 to +125°C
–55 to +125°C [Unit of products]
PACKAGING STYLE AND QUANTITIES
RECOMMENDED PC BOARD PATTERN
0.4 to 0.6
Packaging style
Taping
Quantity
10000 pieces/reel
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm