(1/3)
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1005-E Type
FEATURES
• Compared with the existing MMZ1005 type, this new product
has broad-band impedance values for higher frequency ranges.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Electroplated terminal electrodes accommodate reflow
soldering.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MMZ 1005 S 601 E T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
601:600
Ω
at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1±0.05
0.5±0.05
0.5
0.1min.
0.5±0.05
0.5
0.4
0.5
Weight: 1mg
Dimensions in mm
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Impedance(Ω)
∗
Part No.
MMZ1005S601E
MMZ1005S102E
MMZ1005S182E
MMZ1005A601E
MMZ1005A102E
MMZ1005A152E
MMZ1005A182E
MMZ1005A222E
MMZ1005D121E
MMZ1005D221E
MMZ1005F470E
MMZ1005F750E
MMZ1005F121E
∗
[100MHz]
600±25%
1000±25%
1800±25%
600±25%
1000±25%
1500±25%
1800±25%
2200±25%
120±25%
220±25%
47±25%
75±25%
120±25%
[1GHz]
1000±40%
1400±40%
1800±40%
1400±40%
2000±40%
2300±40%
2700±40%
3000±40%
1000±40%
1700±40%
800±40%
1500±40%
2300±40%
DC
resistance
(Ω)max.
0.70
1.10
1.65
0.85
1.25
1.70
2.20
2.30
0.70
1.00
0.70
1.00
1.50
Rated
current
(mA)max.
300
250
200
300
250
230
200
150
300
250
300
250
200
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
Test equipment
:
E4991A or equivalent
Test tool
:
16192A or equivalent
Test temperature: 25±10°C
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-01 / 20090914 / e9412_mmz1005e.fm
TDK [ TDK ELECTRONICS ]
