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MMZ1608R301A 参数 Datasheet PDF下载

MMZ1608R301A图片预览
型号: MMZ1608R301A
PDF下载: 下载PDF文件 查看货源
内容描述: 片式磁珠( SMD )为信号线 [Chip Beads(SMD) For Signal Line]
分类和应用:
文件页数/大小: 8 页 / 218 K
品牌: TDK [ TDK ELECTRONICS ]
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(1/8)
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1608 Type
FEATURES
• Chip bead(impeder), MMZ series offers 7 construction materials.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
MMZ 1608 R 121 A T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.6±0.15
0.8±0.15
0.3±0.2
0.6
0.8
0.6
Thickness(T)
0.6±0.15mm
0.8±0.15mm
Weight
3mg
4mg
T
0.8
Dimensions in mm
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
012-01 / 20100324 / e9412_mmz1608.fm