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005-02 / 20051003 / e9413_mpz1608.fm
EMC Components
Ferrite Beads
SMD
TDK has manufactured MPZ2012 type as EMI countermeasure
product for power line, and now maximizes impedance to 600
Ω
(at
100MHz) and rated current to 1A, while minimizes Rdc under
150m
Ω
as 1608 type.
FEATURES
• This type is the best for energy-saving in the low DC resistance.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Noise suppression of personal computers, USB/IEEE1394
interfaces, HDDs, CD-ROMs, DVDs, DSCs, LCD panels, cellular
phones, etc.
PRODUCT IDENTIFICATION
MPZ 1608 S 221 A T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L
×
W
(3) Material code
(4) Nominal impedance
221: 220
Ω
at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
ELECTRICAL CHARACTERISTICS
Impedance DC resistance Rated current
∗
Thickness
Part No.
(A)max.
(T)mm
(
Ω
)[100MHz] (
Ω
)max.
0.01
5
0.6
MPZ1608S300A 30±10
Ω
MPZ1608S600A 60±25%
0.02
3.5
0.6
MPZ1608S101A 100±25%
0.03
3
0.6
MPZ1608S221A 220±25%
0.05
2
0.8
MPZ1608R391A 390±25%
0.12
1.2
0.8
MPZ1608S601A 600±25%
0.15
1
0.8
MPZ1608Y600B 60±25%
0.03
2.3
0.8
MPZ1608Y101B 100±25%
0.05
2.0
0.8
MPZ1608Y151B 150±25%
0.07
1.8
0.8
0.07
1.8
0.8
MPZ1608D300B 30±10
Ω
MPZ1608D600B 60±25%
0.12
1.2
0.8
MPZ1608D101B 100±25%
0.15
1.0
0.8
∗
Please refer to the graph of RATED CURRENT vs. TEMPERATURE
CHARACTERISTICS(DERATING) about the rating current at 85°C or
more in temperature of the product.
MPZ Series MPZ1608 Type
Size: JIS/IEC 1608, EIA 0603
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.6±0.15
0.8±0.15
0.3±0.2
0.3±0.2
0.6
0.8
0.6
0.8
Dimensions in mm
Thickness(T)
0.6±0.15mm
0.8±0.15mm
T
Weight
3mg
4mg
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
RATED CURRENT vs. TEMEPERATURE CHARACTERISTICS
(DERATING)
6
5
Rated current(A)
S300A
4
3
2
S600A
S101A
Y600B
R391A,D600B
S221A,Y101B
SY151B,D330B
1
S601A,D101B
–15
5
25
45
65
Temperature(˚C)
85
105
125
0
–55 –35
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.