SIDACtor Device
Thermal Considerations
Package
DO-214AA
Symbol
T
J
T
S
R
qJA
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Thermal Resistance: Junction to Ambient
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
°C/W
+I
+I
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
I
T
I
T
I
S
S
I
H
I
DRM
-V
-V
V
T
V
T
V
DRM
V
DRM
V
S
V
S
100
Peak
Value
Waveform = t
r
x t
d
+V
+V
50
Half Value
0
0
t
r
t
d
t – Time (µs)
-I
-I
V-I Characteristics
t
r
x t
d
Pulse Wave-form
Percent of V
S
Change – %
10
I
H
(T
C
= 25 °C)
14
12
8
6
4
2
0
-4
-6
-8
-40 -20
0
20 40 60 80 100 120 140 160
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-40 -20 0
20 40 60 80 100 120 140 160
I
H
25 °C
25 °C
Ratio of
Case Temperature (T
C
) – °C
Junction Temperature (T
J
) – °C
Normalized V
S
Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
SIDACtor
®
Data Book and Design Guide
2-5
http://www.teccor.com
+1 972-580-7777
Data Sheets
TECCOR [ TECCOR ELECTRONICS ]
