TELEDYNE RELAYS
CENTIGRID
®
SURFACE MOUNT
COMMERCIAL RELAY
DPDT
SERIES
S172
SERIES
DESIGNATION
S172
S172D
DPDT basic relay
RELAY TYPE
DPDT relay with internal diode for coil transient suppression
INTERNAL CONSTRUCTION
DESCRIPTION
The S172 Surface Mount Centigrid
®
relay is an ultraminiature, hermetically sealed, armature
relay for commercial applications. Its low profile height (.470) and .100” grid spaced
terminals, which precludes the need for spreader pads, makes it an ideal choice where
extreme packaging density and/or close PC board spacing are required. The specially
formed leads are pre-tinned to make the relays ideal for all types of surface mount solder
reflow processes.
The basic design and internal structure are similar to the Teledyne DPDT Centigrid
®
relay
(114 Series). Unique construction features and manufacturing techniques provide overall
high reliability and excellent resistance to environmental extremes:
•
•
•
•
•
All welded construction.
Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
High force/mass ratios for resistance to shock and vibration.
Advanced cleaning techniques provide maximum assurance of internal cleanliness.
Precious metal alloy contact material with gold plating assures excellent high current
and dry circuit switching capabilities.
UNI-FRAME
UPPER
STATIONARY
CONTACT
LOWER
STATIONARY
CONTACT
ARMATURE
MOVING
CONTACT
ENVIRONMENTAL AND
PHYSICAL SPECIFICATIONS
Temperature
(Ambient)
Vibration
Shock
Enclosure
Weight
Reflow
Temperature
-55°C to +85°C
10 g’s to 500 Hz (Note 3)
30 g’s for 6 msec. (Note 3)
half-sine
All welded, hermetically sealed
0.15 oz (4.3 gms.) max.
260°C max. temp.
5 min. max. above 180°C
The S172 Series utilizes an internal discrete silicon diodes for coil suppression with
electrical characteristics as specified herein.
By virtue of its inherently low intercontact capacitance and contact circuit losses, the S172
relay is an excellent subminiature RF switch for frequency ranges well into the UHF
spectrum (see Figure 1). Applications include telecommunications, test instruments, mobile
communications, attenuators, and automatic test equipment.
94
TELEDYNE [ TELEDYNE TECHNOLOGIES INCORPORATED ]
