U3665M
Ordering Information
Extended Type Number
Package
DIP16
SO16
Remarks
U3665M-MDP
U3665M-MFP
Pin Description
Pin
1
2
3
4
5
6
7
8
Symbol
Function
Supply voltage for digital part
Not connected
Ground for digital part
Not connected
Sandcastle-pulse input
Not connected
V
DD2
NC
GND2
NC
SC
NC
1
2
3
4
5
6
7
8
16
15
14
13
V
V (R–Y)
DD2
i
NC
NC
GND2
NC
V (B–Y)
i
NC
NC
Not connected
Not connected
NC
9
V
DD1
Supply voltage for analog part
Ground for analog part
±(R–Y) output signal
±(B–Y) output signal
Not connected
±(B–Y) input signal
Not connected
±(R–Y) input signal
10
11
12
13
14
15
16
GND1
SC
12 V (B–Y)
o
V
o (R–Y)
V
o (B–Y)
11
10
9
NC
V (R–Y)
0
NC
V
i (B–Y)
NC
GND1
NC
V
i (R–Y)
NC
V
DD1
95 10649
Figure 2. Connection diagram
Absolute Maximum Ratings
Reference point Pin 3, 10, unless otherwise specified
Parameters
Supply voltage (Pin 9)
Supply voltage (Pin 1)
Voltage on Pins 5, 11, 12, 14 and 16
Output current, (Pin 11, Pin 12)
Power dissipation
Symbol
Min.
–0.5
–0.5
–0.5
Typ.
Max.
+7
+7
Unit
V
V
V
DD1
V
DD2
V
n
V
S
V
I
20
1.1
+150
500
mA
W
°C
V
out
P
T
stg
Storage temperature range
Electrostatic protection* for input/ output pins
–25
* MIL standard 883D, method 3015.7 machine model (all power pins connected together)
Operating Range
Parameters
Supply-voltage range (Pin 1, Pin 9)
Ambient-temperature range
Symbol
Value
4.5 to 5.5
–10 to +70
Unit
V
s
V
°
T
amb
C
Thermal Resistance
Parameters
Symbol
R
thJA
Value
80
Unit
K/W
Junction ambient
2 (9)
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
Preliminary Information
TEMIC [ TEMIC SEMICONDUCTORS ]
