DS_8024RN_020
73S8024RN Data Sheet
Revision History
Revision
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Date
5/18/2004
11/5/2004
4/27/2005
7/15/2005
8/23/2005
12/5/2007
1/17/2008
1/19/2009
Removes leaded package options, replaces 32QFN punched with SAWN
mechanical dimensions, update 28SO package dimensions.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
In
modified the device block diagram to make pin 2 a no connect.
Also, changed the pin description.
In
changed the mechanical drawing for the 20QFN package.
Added the NDS logo to
and assigned document number.
Added the Related Documentation and the Contact Information sections.
Added 20QFN package option and ordering information. Updated 32 QFN
ordering information.
Description
First publication.
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.Teridian.com
Rev. 1.8
27
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
