78M6618 Data Sheet
DS_6618_005
3.1.3 Recommended PCB Land Pattern for the QFN-68 Package
Figure 8: PCB Land Pattern for QFN 68 Package
Table 25: Recommended PCB Land Pattern Dimensions
Symbol
e
x
y
d
A
G
Description
Lead pitch
Pad width
Pad length. Nee Note 3.
See Note 1
Typical Dimension
0.4 mm
0.23 mm
0.8 mm
6.3 mm
6.63 mm
7.2 mm
Notes:
1. Do not place unmasked vias in the region denoted by dimension d.
2. Soldering of bottom internal pad is not required for proper operation.
3. The y dimension has been elongated to allow for hand soldering and reworking. Production
assembly may allow this dimension to be reduced as long as the G dimension is maintained.
26
Rev. 1.4
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
