NTC Thermistor:TCF Type
Lead Frame for Temperature Sensing/Compensation
ꢀ
Reliability
Item
Standard
Test conditions / Methods
Specifications
Gradually applying the force specified and keeping the unit fixed for
10±1 sec
Terminal cross-sectional
Tensile
Strength of
Terminals
Force
IEC60068-2-21
No visible damage
area
(mm2)
(Kg)
0.5
0.1<S≦0.2
Hold specimen and apply the force specified below to each lead. Bend
the specimen to 90°, then return to the original position. Repeat the
procedure in the opposite direction.
Bending
Strength of
Terminals
Terminal cross-sectional
IEC60068-2-21
No visible damage
Force
area
(mm2)
(Kg)
0.25
0.1<S≦0.2
At least 95% of terminal
electrode is covered by
new solder
Solderability
IEC60068-2-20
IEC60068-2-20
235 ± 5℃ , 2 ± 0.5 sec
Resistance to
Soldering Heat
No visible damage
∣△R25/R25∣≦ 3 %
260 ± 5℃ , 10 ± 1 sec
100 ± 5℃ , 1000 ± 24 hrs
High
Temperature
Storage
Damp Heat,
Steady State
No visible damage
∣△R25/R25∣≦ 5 %
IEC60068-2-2
IEC60068-2-3
No visible damage
∣△R25/R25∣≦ 3 %
40 ± 2℃ , 90~95% RH , 1000 ± 24 hrs
Thec conditions shown below shall be repeated 5 cycles
Temperature (℃)
-40 ± 5
Step
Period (minutes)
30 ± 3
1
2
3
4
No visible damage
Rapid Change of
Temperature
IEC60068-2-14
∣△R25/R25∣≦ 3 %
Room temperature
100 ± 5
5 ± 3
30 ± 3
Room temperature
5 ± 3
No visible damage
∣△R25 /R25∣≦ 5 %
Life Test
IEC 60539-1
25 ± 5℃, Pmax. , 1000 ± 24 hrs
MIL-STD-
202F-
Method 302
No visible damage
Insulation Test
500 VDC 1 min
≧100 MΩ
MIL-STD-
202F-
No visible damage
Hi-pot Test
1000 VAC 1 min
Method 301
THINKING ELECTRONIC INDUSTRIAL Co., LTD.
4
www.thinking.com.tw
2008.03