SLUSBC8 – DECEMBER 2013
ORDERING INFORMATION
PART NUMBER
bq51003
MARKING
bq51003
FUNCTION
5V Regulated Power Supply
PACKAGE
DSBGA-YFP
ORDERING NUMBER
(Tape and Reel)
bq51003YFPR
bq51003YFPT
QUANTITY
3000
250
AVAILABLE OPTIONS
DEVICE
bq51003
(1)
(2)
FUNCTION
5-V Power
Supply
WPC
VERSION
v1.1
V
RECT-OVP
15 V
V
OUT-(REG)
5V
OVER
CURRENT
SHUTDOWN
Disabled
AD-OVP
Disabled
TERMINATION
Disabled
COMMUNICATION
CURRENT LIMIT
(1) (2)
Adaptive + 1 s Hold-Off
Enabled if EN2 is low and disabled if EN2 is high
Communication current limit is disabled for 1 second at startup
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
VALUES
MIN
AC1, AC2
RECT, COMM1, COMM2, OUT, CHG, CLAMP1,
CLAMP2
Input voltage
AD, AD-EN
BOOT1, BOOT2
EN1, EN2, FOD, TS-CTRL, ILIM
Input current
Output current
Output sink current
Junction temperature, T
J
Storage temperature, T
STG
ESD Rating (100 pF, 1.5 kΩ)
(1)
(2)
Human Body Model (HBM)
Charge Device Model (CDM)
AC1, AC2
OUT
CHG
COMM1, COMM2
–40
–65
2
500
–0.8
–0.3
–0.3
-0.3
–0.3
MAX
20
20
30
26
7
1
525
15
1
150
150
UNITS
V
V
V
V
V
A(RMS)
mA
mA
A
°C
°C
kV
V
All voltages are with respect to the VSS terminal, unless otherwise noted.
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC
(1)
θ
JA
θ
JCtop
θ
JB
ψ
JT
ψ
JB
θ
JCbot
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
YFP
28 PINS
58.9
0.2
9.1
1.4
8.9
n/a
°C/W
UNITS
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
2
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