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SN74LVC1G32DCKR 参数 Datasheet PDF下载

SN74LVC1G32DCKR图片预览
型号: SN74LVC1G32DCKR
PDF下载: 下载PDF文件 查看货源
内容描述: 单路2输入正或门 [SINGLE 2-INPUT POSITIVE-OR GATE]
分类和应用: 栅极逻辑集成电路光电二极管输入元件
文件页数/大小: 17 页 / 443 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2005
PACKAGING INFORMATION
Orderable Device
SN74LVC1G32DBVR
SN74LVC1G32DBVRE4
SN74LVC1G32DBVRG4
SN74LVC1G32DBVT
SN74LVC1G32DBVTE4
SN74LVC1G32DCKR
SN74LVC1G32DCKRE4
SN74LVC1G32DCKRG4
SN74LVC1G32DCKT
SN74LVC1G32DCKTE4
SN74LVC1G32DRLR
SN74LVC1G32DRLRG4
SN74LVC1G32YEAR
SN74LVC1G32YEPR
SN74LVC1G32YZAR
SN74LVC1G32YZPR
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
SC70
SC70
SC70
SC70
SOP
SOP
WCSP
WCSP
WCSP
WCSP
Package
Drawing
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DRL
DRL
YEA
YEP
YZA
YZP
Pins Package Eco Plan
(2)
Qty
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
SNPB
SNPB
SNAGCU
SNAGCU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
3000
3000
3000
3000
TBD
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1