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SN74LVC2G14DCKR 参数 Datasheet PDF下载

SN74LVC2G14DCKR图片预览
型号: SN74LVC2G14DCKR
PDF下载: 下载PDF文件 查看货源
内容描述: 双施密特触发器逆变器 [DUAL SCHMITT-TRIGGER INVERTER]
分类和应用: 栅极触发器逻辑集成电路光电二极管
文件页数/大小: 15 页 / 384 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
www.ti.com
SCES200J – APRIL 1999 – REVISED JUNE 2005
FEATURES
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 5.4 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25°C
I
off
Feature Supports Partial-Power-Down
Mode Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
1A
GND
2A
1
2
3
6
5
4
1Y
V
CC
2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A
GND
1A
3 4
2 5
1 6
2Y
V
CC
1Y
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V V
CC
operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
(1)
(2)
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
ORDERABLE PART NUMBER
SN74LVC2G14YEAR
SN74LVC2G14YZAR
Reel of 3000
SN74LVC2G14YEPR
SN74LVC2G14YZPR
SN74LVC2G14DBVR
SN74LVC2G14DBVT
SN74LVC2G14DCKR
SN74LVC2G14DCKT
C14_
CF_
_ _ _CF_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2005, Texas Instruments Incorporated