TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999
TL084Y chip information
These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
VCC+
(4)
+
–
+
–
+
–
+
–
(11)
VCC –
(2)
(3)
(4)
(6)
1IN +
1IN –
2OUT
3IN +
(14)
(8)
(7)
(3)
(2)
(1)
1OUT
(5)
(6)
(8)
3OUT
(12)
(13)
4IN +
4IN –
2IN +
2IN –
(13)
(12)
(11)
(10)
(9)
(7)
(10)
(9)
62
3IN –
4OUT
(14)
(1)
105
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
6
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
