tm
TE
CH
T35L6432B
SYNCHRONOUS
BURST SRAM
FEATURES
•
Fast Access times: 9 / 10 / 11 / 12 ns
•
Single 3.3V (+0.3V/-0.165V) power supply
•
Common data inputs and data outputs
•
Individual BYTE WRITE ENABLE and
GLOBAL WRITE control
•
Three chip enables for depth expansion and
address pipelining
•
Clock-controlled and registered address, data
I/Os and control signals
•
Internally self-timed WRITE CYCLE
•
Burst control pins ( interleaved or linear burst
sequence)
•
High 30pF output drive capability at rated access
time
•
SNOOZE MODE for reduced power standby
•
Burst Sequence :
- Interleaved (MODE=NC or VCC)
- Linear (MODE=GND)
64K x 32 SRAM
Flow-Through Burst Mode
GENERAL DESCRIPTION
The Taiwan Memory Technology Synchronous
Burst RAM family employs high-speed, low power
CMOS design using advanced triple-layer polysilicon,
double-layer metal technology. Each memory cell
consists of four transistors and two high valued resistors.
The T35L6432B SRAM integrates 65536 x 32
SRAM cells with advanced synchronous peripheral
circuitry and a 2-bit counter for internal burst operation.
All synchronous inputs are gated by registers controlled
by a positive-edge-triggered clock input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining
inputs (
ADSC
,
chip
enable
(
CE
), depth-
expansion chip enables (
CE2
and CE2), burst control
ADSP
, and
ADV
), write enables
(
BW1
,
BW2
,
BW3
,
BW4
, and
BWE
), and
global write (
GW
).
Asynchronous inputs include the output enable
(
OE
), Snooze enable (ZZ) and burst mode control
(MODE). The data outputs (Q), enabled by
OE
, are
also asynchronous.
Addresses and chip enables are registered with
either address status processor (
ADSP
) or address
status controller (
ADSC
) input pins. Subsequent burst
addresses can be internally generated as controlled by
the burst advance pin (
ADV
).
Address and write controls are registered on-chip
to initiate self-timed WRITE cycle. WRITE cycles
can be one to four bytes wide as controlled by the write
control inputs. Individual byte write allows individual
OPTIONS
MARKING
-9
Access
9ns
Flow-
time
through
Cycle
2-1-1-1
10.5ns
time
-10
10ns
15ns
-11
11ns
15ns
-12
12ns
15ns
PACKAGE
100-pin QFP
100-pin TQFP
package code
Q
T
Part Number Examples
PART NO.
T35L6432B-10Q
T35L6432B-12T
speed
10ns
12ns
Package
QFP
TQFP
BW1
controls DQ1-DQ8.
BW2
controls DQ9-DQ16.
BW3
controls DQ17-
BW4
controls DQ25-DQ32.
BW1
,
DQ 24.
BW2
,
BW3
, and
BW4
can be active only with
BWE
being LOW.
GW
being LOW causes all
byte to be written.
bytes to be written. WRITE pass-through capability
allows written data available at the output for the
immediately next READ cycle. This device also
incorporates pipelined enable circuit for easy depth
expansion without penalizing system performance.
Taiwan Memory Technology, Inc. reserves the right
to change products or specifications without notice.
P. 1
Publication Date: JUL. 2002
Revision: A
TMT [ TAIWAN MEMORY TECHNOLOGY ]
