REQUIREMENTS
Terminal Strength
Vibration
Dropping
TRCM Chip Wirewound Inductors
TRCM322522, TRCM453232 - Mechanical Performance Test
CHARACTERISTICS
No evidence of damage
Δ L/L shall be within ±3%.
No evidence of damage
Δ L/L shall be within ±3%.
No evidence of damage
TEST METHOD(DIS C 5321)
Terminals shall withstand a pull of 0.5Kgf
in a horizoninal direction
2 hours in each direction of X,Y,Z on p-Board
at a frequency range of 10-55-10HZ with
1.5mm amplitude
Dropping 1m over the ground of conctete or
cement
TRCM322522, TRCM453232 - Electrical Performance Test
REQUIREMENTS
Resistance to Soldering Heat
Solderability
Dielectric with
standing voltage
Insulation Resistance
CHARACTERISTICS
No evidence of damage
Δ L/L shall be within ±3%
More than 90% surface to
be covered with new soldering
No veridence of breakdown
resistor 1000 Mohm and over
No veidence of breakdown,
resistor 1000 Mohm and over
TEST METHOD(JIS C 5321)
Immerse in the solder (H63A) of 260±5°C for
10±1sec, leave for 2hrs at normal TEMP
AV100V 60 SEC.
DC500V 30 SEC.
DC 500V 30 SEC.
TRCM322522, TRCM453232 - Climatic Test
REQUIREMENTS
LOW TEMP. Characteristics
CHARACTERISTICS
No evidence of damage,
Δ L/L within ±5%,
Q/Q within ±30%
No evidence of damage,
Δ L/L within ±5
Δ L/L within ±3%
No evidence of damage,
Δ L/L within ±5%,
Q/Q within ±30
No evidence of damage,Δ L/L
within ±5%,Q/Q within ±30
TEST METHOD(JIS C 5321)
Immerse in the solder (H63A)of 260±5°C
for 10±1sec, leave for 2hrs at normal TEMP.
Keep for 30 min. at TEMP.of -25°C~+85°
Cat 5 cycle case of TEMP. change from low to high
and V.V.
Δ L/L to be measured at the temperature
of between -25°C and +85°C
TEMP.40±2°C,Humidity 90~95% 96± 2hrs,
measurements shall be performed after 1~2hrs at
normal TEMP..
Leave for 96±2hrs in a bath of
TEMP.85±2°C,measurements shall be performed
after 1~2hrs at normal TEMP.
TEMP. Cycling
Temperature Characteristics
Moiisture load Characteristics
High TEMP. overload
Characteristics
06 of 07
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