Item
Flexure Strength
TRMB Chip Multilayer Bead Inductors
Environmental Characteristics
Test Methods
Test device shall be soldered on the substrate Substrate
Dimension:100×40×1.6mm
20
Deflection: 2.0mm
1.6
Keeping Time: 30sec
2
For 0402, substrate dimension
45
45
is 100×40×0.8mm
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1min Amplitude :
1.5mm
Time : 2hrs for each axis (X,Y&Z), total 6hrs
Appearance: No damage
Pre-heating: 150°C, 1min
More than 75% of the
Solder Temperature: 260 ± 5°C
terminal electrode should be Immersion Time: 10 ± 1sec
covered with solder.
Impedance: within± 30%
of initial value
The electrodes shall be
Pre-heating: 150°C, 1min
at least 90% covered
Solder Temperature: 245 ± 5°C
with new solder coating
Immersion Time: 4 ± 1sec
0402 series : ≥0.2kg
Test device
0603 series : ≥0.5kg
shall be soldered
W
0805 series : ≥1.0kg
on the substrate
other series : ≥ 2.0kg
Appearance: No damage
One cycle:
Impedance: within ± 30%
One cycle/step1: -55 ± 3°C for 30mi
of initial value
step2: 25 ± 2°C for 3.0min
step3:125 ± 3°C for 30min
step4:25 ± 2°C for 3.0min
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Temperature: 40 ± 2°C
Relative Humidity: 90 ~ 95% time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: 125 ± 3°C
Relative Humidity : 0%
Applied Current: Rated Current time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: -55 ± 3°C
TR elative Humidity : 0% time: 1000hrs
Measured after exposure in the room condition for 24hrs
Specification
The forces applied on
the right conditions must
not damage the terminal
electrode and the ferrite
Vibration
Resistance to
Soldering
Heat
Solderability
Terminal
Strength
Test
Temperature
Cycle
Humidity
Resistance
High
Temperature
Resistance
Low
Temperature
Resistance
Version 2010
http://www.token.com.tw/
rfq token.com.tw
03 of 17
TOKEN [ TOKEN ELECTRONICS INDUSTRY CO., LTD. ]
