TK11816, TK11817,
TK11818, TK11819
TYPICAL PERFORMANCE CHARACTERISTICS (CONT.)
T
A
= 25
°C,
unless otherwise specified.
TK11819 (V
OUT
- T
1
JUMPERED)
OUTPUT VOLTAGE
VS.
OUTPUT CURRENT
30
OUTPUT VOLTAGE CHANGE
VS.
TEMPERATURE
30
500
OUTPUT VOLTAGE AND SUPPLY
CURRENT
VS.
INPUT VOLTAGE
VIN = 2 V
VOUT
∆V
OUT (mV)
VOUT (V)
20
VOUT (V)
20
4V
8V
6V
10 V
0
20
400 µA
200 µA
10
IOUT = 0
10
0
5
IOUT (mA)
10
-500
-50
10
0
TA (°C)
OUTPUT VOLTAGE CHANGE
VS.
TEMPERATURE
40
50
100
0
1
2
3
IIN
4
0
5
VIN (V)
OUTPUT VOLTAGE AND SUPPLY
CURRENT
VS.
INPUT VOLTAGE
TK11819 (V
OUT
- T
1
OPEN)
OUTPUT VOLTAGE
VS.
OUTPUT CURRENT
40
500
20
∆V
OUT (mV)
VOUT (V)
VOUT (V)
VIN = 2 V
30
4V
6V
8V
VOUT
30
400 µA
200 µA
10
0
IOUT = 0
20
0
1
2
3
4
5
IOUT (mA)
-500
-50
20
0
TA (°C)
50
100
0
1
2
3
VIN (V)
IIN
4
0
5
APPLICATION INFORMATION
HANDLING MOLDED RESIN PACKAGES
All plastic molded packages absorb some moisture from the air. If moisture absorption occurs prior to soldering the device
onto the printed circuit board, increased separation of the lead from the plastic molding may occur, degrading the moisture
barrier characteristics of the device. This property of plastic molding compounds should not be overlooked, particularly
in the case of very small packages, where the plastic is very thin. In order to preserve the original moisture barrier
properties of the package, devices are stored and shipped in moisture proof bags, filled with dry air. The bags should not
be opened or damaged prior to the actual use of the devices. If this is unavoidable, the devices should be stored in a low
relative humidity environment (40 to 65%) or in an enclosed environment with desiccant.
January 1999 TOKO, Inc.
Page 7
IIN (mA)
IIN (mA)
TOKO [ TOKO, INC ]
