TMC262 DATASHEET (Rev. 2.07 / 2013-FEB-14)
55
19 Package Mechanical Data
19.1 Dimensional Drawings
Attention: Drawings not to scale.
Figure 19.1 Dimensional drawings
Parameter
Total thickness
Standoff
Mold thickness
Lead frame thickness
Lead width
Body size X
Body size Y
Lead pitch
Exposed die pad size X
Exposed die pad size Y
Lead length
Package edge tolerance
Mold flatness
Coplanarity
Lead offset
Exposed pad offset
Ref
A
A1
A2
A3
b
D
E
e
J
K
L
aaa
bbb
ccc
ddd
eee
Min
0.80
0.00
-
0.2
Nom
0.85
0.035
0.65
0.203
0.25
5.0
5.0
0.5
3.3
3.3
0.4
Max
0.90
0.05
0.67
0.3
3.2
3.2
0.35
3.4
3.4
0.45
0.1
0.1
0.08
0.1
0.1
19.2 Package Code
Device
TMC262
Package
QFN32 (RoHS)
Temperature range
-40° to +125°C
Code/ Marking
TMC262-LA
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