TQP7M9102
½W High Linearity Amplifier
Pin Configuration and Description
GND
4
1
RF IN
2
GND
3
RF OUT
Pin
1
2, 4
3
Symbol
RF IN
GND
RFout / Vcc
Description
RF Input. Requires external match for optimal performance. External DC Block
required.
RF/DC Ground Connection
RF Output. Requires external match for optimal performance. External DC Block
and supply voltage is required.
Applications Information
PC Board Layout
PCB Material (stackup):
1 oz. Cu top layer
0.014 inch Nelco N-4000-13,
ε
r
=3.7
1 oz. Cu MIDDLE layer 1
Core Nelco N-4000-13
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062±.006
50 ohm line dimensions: width = .031”, spacing = .035”.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from supplier to supplier, careful process development is
recommended.
Data Sheet: Rev D 10/04/11
© 2011 TriQuint Semiconductor, Inc.
-
7 of 9
-
1071363AW REV - 1071363PC REV -
+V
CC
GND
SOT89 EVAL. BRD., 1/2 WATT
Disclaimer: Subject to change without notice
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