TQP7M9101
¼W High Linearity Amplifier
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-
compliant. The plating material on the
leads is NiPdAu. It is compatible with
both lead-free (maximum 260 °C reflow
temperature) and lead (maximum 245 °C
reflow temperature) soldering processes.
The component will be marked with a
“7M9101”
designator
with
an
alphanumeric lot code on the top surface
of package.
7M9101
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. RF trace width depends upon the PC board material and construction.
4. Use 1 oz. Copper minimum.
Advanced Data Sheet: Rev D 09/19/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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