Data Sheet
Features
•
•
•
•
•
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For AMPS, TDMA, CDMA applications
Usable bandwidth 25 MHz
High attenuation
No impedance matching required for operation
at 50
Ω
Single-ended operation
Chip Scale Package (CSP)
Ceramic surface mount package
Hermetic
Part Number 856243
836.5 MHz SAW Filter
•
Package
Surface Mount 2.00 x 1.50 x 0.76 mm
Pin Configuration
Bottom View
1
2
0.76 NOM.
0.84 MAX.
2.00
1.80
4
3
1.50
1.30
0.42
Pin No.
1
3
2,4
Description
Input
Output
Case ground
0.25x45° CHAMFER
0.56
Dimensions shown are nominal in millimeters
All tolerances are
±0.10mm
Body:
Al
2
O
3
ceramic
Lid:
Kovar
or
Alloy 42, Au
over
Ni
plated
Terminations:
Au
plating 0.5 - 1.0µm,
over a 2 - 6µm
Ni
plating
Subject to change or obsolescence without notice
Rev -
21-Nov-2002
Page 1 of 6
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
