Advance Product Information
October 30, 2003
TGA2510-EPU-SG
Package Pinout Diagram
V
REF
RF IN
VD
RF OUT
VG
V
DET
Package Assembly Diagram
VD
10W
1mF
RF IN
RF OUT
10W
VG
1mF
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
8
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com