Product Data Sheet
February 21, 2005
TGA2902-SCC-SG
TABLE I
MAXIMUM RATINGS
Symbol
V
D
V
G
I
D
| I
G
|
P
IN
P
D
T
CH
T
M
T
STG
1/
2/
3/
4/
Drain Voltage
Gate Voltage Range
Drain Supply Current (Quiescent)
Gate Supply Current
Input Continuous Wave Power
Power Dissipation
Operating Channel Temperature
Mounting Temperature
(30 Seconds)
Storage Temperature
Parameter
Value
8V
-5V to 0V
1300 mA
18 mA
24 dBm
6.15 W
150
0
C
220
0
C
-65 to 150
0
C
Notes
1/ 2/
1/
1/ 2/
1/
1/ 2/
1/ 2/ 3/
4/
These ratings represent the maximum operable values for this device
Combinations of supply voltage, supply current, input power, and output power
shall not exceed P
D
at a package base temperature of 70°C
When operated at this bias condition with a baseplate temperature of 70°C, the
MTTF is reduced from 4.8E+6 to 1.0E+6 hours
Junction operating temperature will directly affect the device median time to failure
(MTTF). For maximum life, it is recommended that junction temperatures be
maintained at the lowest possible levels.
TABLE II
THERMAL INFORMATION
Parameter
R
ΘJC
Thermal Resistance
(Channel to Backside of
Package)
Test Conditions
V
D
= 7.5V
I
D
= 650mA
P
DISS
= 4.88W
T
BASE
= 70°C
T
CH
(qC)
132.3
R
4
JC
(qC/W)
12.8
MTTF
(hrs)
4.8E+6
TriQuint Semiconductor Texas Phone : (972)994 8465
Fax: (972)994 8504 Web: www.triquint.com
2
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