TGC4402-SM
Assembly Notes
Recommended Surface Mount Package Assembly
•
Proper ESD precautions must be followed while handling packages.
•
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
•
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
•
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
•
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and Temperature
Time above Melting Point
Max Peak Temperature
Time within 5
°C
of Peak Temperature
Ramp-down Rate
SnPb
3
°C/sec
60 – 120 sec @ 140 – 160
°C
60 – 150 sec
240
°C
10 – 20 sec
4 – 6
°C/sec
Pb Free
3
°C/sec
60 – 180 sec @ 150 – 200
°C
60 – 150 sec
260
°C
10 – 20 sec
4 – 6
°C/sec
Ordering Information
Part
TGC4402-SM
Package Style
QFN 4x4 Surface Mount
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
12
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
April 2012 © Rev A
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
