TGL6425-SCC
1,8288 (0.0720)
1,6358 (0.0644)
1,3970 (0.055)
MECHANICAL DRAWING
2
3
4
5
6
1,0592 (0.0417)
2,0396 (0.0803)
1
7
1,0592 (0.0417)
0,1880 (0.0074)
12
11
10
9
8
0.0
0,5029 (0.0198)
0,8077 (0.0318)
1,1049 (0.0435)
1,3691 (0.0539)
1,7145 (0.0675)
2,1844 (0.0860)
0.0
Units: Millimeters (inches)
Thickness: 0,102 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF In): 0,127 x 0,207 (0.0050 x 0.0082)
Bond pad #2 (V
1
):
Bond pad #3 (V
3
):
Bond pad #4 (V
2
):
Bond pad #5 (V
5
):
Bond pad #6 (V
10
):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #7 (RF Out): 0,246 x 0,119 (0.0097 x 0.0047)
Bond pad #8 (V
4
):
Bond pad #9 (V
7
):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad 1#0 (V
6
): 0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #11 (V
8
): 0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #12 (V
9
): 0,120 x 0,120 (0.0047 x 0.0047)
6
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
