TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Application Circuit
PC Board Layout
Top RF layer is 0.008” thick Roger RO4003, є
r
= 3.38. Microstrip 50Ω line detail: width =0.0175”. For further
technical information, refer to the
Product Information page.
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount
processes vary from company to company, careful process development is recommended.
Top layer
Roger 4003
GND layer
1 oz Cu
0.008"
1/2 oz Cu
FR4
0.062"
Bottom layer
1 oz Cu
Bill of Material
Ref Des
C1
C2
C3
R1, R2
Value Description
100 pF Ceramic Cap, 0402
1 µF
10 µF
Ceramic Cap, 0603
Tantalum Cap, 0805/1206
Manufacturer
various
various
various
various
Part Number
0 ohm Chip Res, 0402
Data Sheet: RevA 12/12/12
© 2012 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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