TQS Reliability Report # 00-08
TQ8223
Device Qualification
Abstract
This report summarizes the reliability testing that has been performed to qualify the TQ8223
product. The SC5068 is a Superset of the TQ8223 and was previously qualified. The TQ8213,
which is also packaged in a 208 BGA, was used as an additional lot for dimensional qualification.
TQ8223 and SC5068
Both of these parts are fabricated on TriQuint's 0.6µm E/D MESFET GaAs process and are
packaged in a 208 BGA package. Tests, test sample size and failure criteria were defined from
TriQuint’ Specification REL.021 (Policy and Procedure for Reliability Qualifications of ICs). Tests
s
outlined in this procedure follow the JEDEC Standard Number 26-A or MIL-STD-883 when
applicable.
For further information please contact:
TriQuint Semiconductor
2300 N.E. Brookwood Parkway
Hillsboro, OR 97124
Phone: (503) 615-9000
FAX: (503) 615-8900
Reliability Test Report
08/01/00