TQM8M9077
0.05-4 GHz Digital Variable Gain Amplifier
Pin Description
Pin #
1
2, 3, 13, 28, 30, 31, 32
11, 15, 16, 18-24
29
12
4
5, 6, 7, 8, 9, 10
14
17
25
26
27
Backside Paddle
Symbol
Ampin
GND (Ground)
NC (No Connect)
Ampout
ATTin
ATTout
ACG1-6
SOD
Vdd
CLK
SID
LE
RF/DC Ground
Description
Amp RF input
DC ground
No electrical connection. Provide land pads for PCB mounting integrity.
Amp RF output / DC supply
DSA Input
DSA Output
Place external capacitor to Ground for applications below 700 MHz.
Serial Data Out
DC supply
Serial Clock
Serial Data In
Latch Enable
RF/DC ground. Provide recommended via pattern (see page 8) and ensure
good solder attach for best thermal and electrical performance.
Applications Information
PC Board Layout
PCB Material (stackup):
1 oz. Cu top layer
0.014 inch Nelco N-4000-13 (ε
r
=3.7 typ.)
1 oz. Cu middle layer 1
Core Nelco N-4000-13
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062±.006 inches
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from company to company, careful process development
is recommended.
Datasheet: Rev D 01-20-12
© 2012 TriQuint Semiconductor, Inc.
-
7 of 9
-
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
