TQP3M9018
High Linearity LNA Gain Block
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-compliant.
The plating material on the leads is annealed
matte tin. It is compatible with both lead-
free (maximum 260 °C reflow temperature)
and lead (maximum 245 °C reflow
temperature) soldering processes.
The component will be marked with an
“9018” designator with an alphanumeric lot
code on the top surface of package.
TriQuint
9018
YYWW
aXXXX
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Data Sheet: Rev J 11/01/11
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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