DB3-DB3TG
150mW Bi-directional Trigger Diode
Small Signal Diode
DO-35 Axial Lead
HERMETICALLY SEALED GLASS
Features
Designed for through-Hole Device Type Mounting.
Hermetically Sealed Glass.
All external suface are corrosion resistant and
terminals are readily solderable.
High reliability glass passivation insuring parameter
stability and protection against junction contamination.
Pb free version and RoHS compliant
A
D
C
B
Mechanical Data
Case :DO-35 Solder Hot Dip Tin (Sn) lead finish
Terminal: Pure tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Marking : DB3/DB3TG
Weight : 0.1255 gram (approximately)
Dimensions
A
B
C
D
Unit (mm)
Min
0.45
3.05
25.4
1.53
Max
0.55
5.08
38.1
2.28
Unit (inch)
Min
Max
0.018 0.022
0.120 0.200
1.000 1.500
0.060 0.090
Ordering Information
Part No.
DB3/DB3TG RI
Package
DO-35
Packing
5Kpcs / 10" Reel
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Forward Current
Pulse Width=
20μsec
Symbol
P
D
I
FRM
RθJA
T
J
, T
STG
Value
150
2
400
-40 to + 125
Units
mW
A
°C/W
°C
Thermal Resistance (Junction to Ambient) (Note 1)
Junction and Storage Temperature Range
Electrical Characteristics
Type Number
Break-over Voltage
Break-over Voltage Symmetry
Break-over Current
Maxiumn Leakage Current
Junction Capacitance
Output Voltage
Reverse Recovery Time
(Note2)
C=
C=
C=
V
R
=
22nF
22nF
22nF
0.5V
Symbol
V
BO
+ / -V
BO
I
BO
I
R
C
J
V
O
Trr
DB3
32
+/-3
100
10
22.0
5
1.5
DB3TG
32
+/-2
15
Units
V
V
nA
μA
nF
V
μs
V
R
=0, f=1.0MHz
Notes:1. Valid provided that electrodes are kept at ambient temperature
Notes:2. Test Condition : I
F
=0.5A, R
L
=100Ω
Version : C09
TSC [ TAIWAN SEMICONDUCTOR COMPANY, LTD ]
