5.5-9GHz Power Amplifier
Package outline
(1)
CHA6250-QFG
Matt tin, Lead Free
Units :
From the standard :
(Green)
mm
JEDEC MO-220
(VGGD)
33- GND
1-
2-
3-
4-
5-
6-
7-
8-
9-
10-
11-
Nc
Nc
Gnd
(2)
RF IN
Gnd
(2)
Nc
Nc
Nc
Nc
Nc
Nc
12-
13-
14-
15-
16-
17-
18-
19-
20-
21-
22-
Gnd
(2)
VG
Nc
Nc
Nc
Nc
Nc
Nc
Gnd
(2)
RF OUT
Gnd
(2)
23-
24-
25-
26-
27-
28-
29-
30-
31-
32-
Nc
Nc
VD3
Gnd
(2)
Nc
VD2
Gnd
(2)
VD1
Nc
Nc
(1)
The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2)
It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHA6250-QFG2272 - 28 Sep 12
9/14
Specifications subject to change without notice
Bat. Charmille - Parc SILIC - 10,
Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
