CHR3762-QDG21 参数 Datasheet PDF下载

CHR3762-QDG

5.5-9GHz Integrated Down Converter

Device thermal performances

All the figures given in this section are obtained assuming that the QFN device is cooled

down only by conduction through the package thermal pad (no convection mode considered).

The temperature is monitored at the package back-side interface (Tcase) as shown below.

The system maximum temperature must be adjusted in order to guarantee that Tcase

remains below the maximum value specified in the next table. So, the PCB system must be

designed to comply with this requirement.

A derating must be applied on the dissipated power if the Tcase temperature can not be

maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to

guarantee the nominal device life time (MTTF).

DEVICE THERMAL SPECIFICATION : CHR3762-QDG

Recommended max. junction temperature (Tj max)

:

131

Junction temperature absolute maximum rating

:

175

Max. continuous dissipated power (Pdiss. Max.)

:

0,3

(1)

=> Pdiss. Max. derating above Tcase = 85

°C :

5

(2)

Junction-Case thermal resistance (Rth J-C)

:

<183

(3)

Minimum Tcase operating temperature

:

-40

(3)

Maximum Tcase operating temperature

:

85

Minimum storage temperature

:

-55

Maximum storage temperature

:

150

(1 Derating at junctio n temperature co nstant = Tj max.

)

°C

°C

W

mW/°C

°C/W

°C

°C

°C

°C

(2) Rth J-C is calculated fo r a wo rst case co nsidering the

ho t t e s t junc t io n

o f the M M IC and all the devices biased.

(3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w).

0,3

0,25

0,2

Tcase

Pdiss. Max. @Tj <Tj max (W)

0,15

0,1

Pdiss. Max. @Tj <Tj max (W)

0,05

0

-50

-25

0

25

50

Tcase (°C)

75

100

125

150

Example: QFN 16L 3x3

Location of temeprature

reference point (Tcase)

on package's bottom side

6.1

Ref. : DSCHR3762-QDG2335 - 30 Nov 12

4/16

Specifications subject to change without notice

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