CHU3277
W-band Multiplier/MPA
As the connection at 77GHz (between MMIC and external substrate) is critical, the transition
matching network is split into two parts: one on MMIC and one on the external substrate. The
following drawing gives the dimensions for a RO3003 substrate.
RO3003 thickness = 0.127 mm,
εr=3.
0.78
0.225
0.3
0.3
0.15
0.15
0.1
Bonding area
0.328
0.15
0.1
Proposed matching network for a transition between MMIC Output port and
a 50Ω microstrip line on RO3003 substrate.
Ref. DSCHU3277391 - 01 Apr 03
6/7
Specifications subject to change without notice
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