MFC-PO13811-QDG 参数 Datasheet PDF下载

MFC-PO13811-QDG

37-40GHz Down Converter

Proposed Assembly board “96401” for the 24L-QFN4x4 product

characterization.

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Compatible with the proposed footprint.

Based on typically Ro4003 / 8mils or equivalent.

Using a microstrip to coplanar transition to access the package.

Recommended for the implementation of this product on a module board.

Vdl Gnd Vgx

Vgm Vdx

10nF capacitor 0603

Hybric coupler 90° Anaren 11306-3

The DC connections do not include any decoupling capacitor in package, therefore it is mandatory

to provide a good external DC decoupling on the PC board, as close as possible to the package.

The SMD leadless package has been designed for high volume surface mount PCB assembly

process. A typical footprint is proposed for the PCB (motherboard) in the previous drawing. For the

mounting process standard techniques involving solder paste and a suitable reflow process can be

used. For further details, see application note AN0017.

Ordering Information

QFN 4x4 RoHS compliant package:

MFC-PO13811-QDG/XY

Stick: XY = 20

Tape & reel: XY = 21

Information furnished is believed to be accurate and reliable. However

United Monolithic Semiconductors S.A.S.

assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other

rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or

patent rights of

United Monolithic Semiconductors S.A.S..

Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

United Monolithic

Semiconductors S.A.S.

products are not authorised for use as critical components in life support devices or systems

without express written approval from

United Monolithic Semiconductors S.A.S.

Ref. DSMFC-PO13811-QDG7092 - 02 Apr 07

10/10

Specifications subject to change without notice

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