LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
MCM1012B Series
Features and Application
Powerful components with composite co-fired material to
solve
EMI
problem
for
high
speed differential
signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
MIPI, MHL serial interface in mobile device.
PRODUCT DETAIL
Imp.Com.
(Ω)±25%
@100MHz
36
67
90
◆
◆
◆
◆
DCR
Max.
(Ω)
0.50
0.50
0.60
Rated
Current
Max.(m A)
300
300
300
Rated
Voltage
(V)
10
10
10
Withstand
Voltage
(V)
25
25
25
Insulation
Resistance
Min.(MΩ)
200
200
200
Part Number
MCM1012B360F06BP
MCM1012B670F06BP
MCM1012B900F06BP
Test Instruments
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
HP4338 MILLIOHMMETER
Agilent E5071C ENA SERIES NETWORK ANALYZER
Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
MCM
1
1012
2
B
3
90 0
4
F
06 B
7
P
5 6
8 9
1: Series name
2: Dimensions L*W
3: Material code
4: Impedance(Ω)
±25%
5: Fixed Decimal Point
6: Rated Current Code
A=50mA
B=80mA
G=400mA
H=500mA
(ex：900=90Ω)
C=100mA
I=600mA
D=150mA
J=700mA
E=200mA
K=800mA
F=300mA
7: Dimension T (ex : 06=0.60mm)
8:Soldering:Green Parts:A-Soldering Lead-FREE B-Lead-Free for whole chip
9: Packaging style P
–
Embossed paper tape, 7”reel.
UN Semiconductor Co., Ltd.
Revision December 18, 2014
@ UN Semiconductor Co., Ltd.
2014
1/6
Specifications are subject to change without notice.
UNSEMI [ UN Semiconducctor INC ]
