Surface Mount Transient Voltage Suppressors (TVS)
SMF Series
5.0 To 190 V
200W
I-V Curve Characteristics
Environmental Specifications
Physical Specifications
SOD-123 Molded Plastic over glass
passivated junction
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
JESD22-A104
Case
JESD22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Color band denotes cathode except
Bipolar
Polarity
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102D
Thermal Shock
Soldering Parameters
Reflow Condition
Lead–free assembly
TP
Critical Zone
TL to TP
-Temperature Min (Ts(min)
)
-Temperature Max (Ts(max)
- Time (min to max) (ts)
150°C
Ramp-up
TL
Pre Heat
)
200°C
TS(max)
60 -180 Seconds
Ramp-down
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/second max
3°C/second max
TS(min)
TS(max) to TL - Ramp-up Rate
Preheat
- Temperature (TL) (Liquidus) 217°C
- Time (min to max) (ts) 60 -150 Seconds
25
Time to peak temperature
Reflow
Time
(t 25℃ to peak)
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of actual peak
Temperature (tp)
20 -40 Seconds
Ramp-down Rate
6°C/second max
8 minutes Max
280°C
Time 25°C to peak Temperature (TP)
Do not exceed
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Revision October 18, 2013
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