Engineering Specification
TCFE03025H90002A
RECOMMENDED REFLOW SOLDERING
A
B
C
1 rising temperature
temperature
Preheating
140℃ to 160℃
60s to 120s
20s to 40s
50s½60s
40s½50s
30s½40s
20s½40s
20s½40s
1℃/s
½
4℃/s
st
The normal to Preheating
30s to 60s
2
nd
rising temperature Preheating to 200℃
if 220℃
if 230℃
D
Main heating
if 240℃
if 250℃
if 260℃
E
Regular cooling
According to J-STD-020C
200℃ to 100℃
UN Semiconductor Co., Ltd.
Revision December 18, 2014
6/6
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
UNSEMI [ UN Semiconducctor INC ]
