Surface Mount Bi-Color Chip LEDs
Description
The MSL-155xx , a series of bi-color Chip LED device ,
is designed in an industry standard package suitable for
SMT assembly method . This series contain different
combinations of Red & Green chips to provide broad
range choices in wavelength and intensity . They are
all molded in water clear epoxy package.
A
B
MSL-155XX SERIES
LED die
A (Short wavelength)
2.7
(.106)
+
+
2.0
(0.079)
LED die
B (Long wavelength)
Cathode mark
0.50
(.020)
Package Dimensions
1.6
(0.063)
3.2
(.126)
+
+
1.4
(0.055)
0.6
(0.024)
Features
l
l
l
l
PCB
0.60
(.024)
Small Size
Industry Standard Footprint
Compatible with IR Solder process
Availalble in 8 mm Tape on 7"(178mm)
Diameter Reels
0.5
(.02)
2.20
(0.087)
+
0.90
(0.036)
+
+
l
Dual color
Applications
l
l
l
l
+
0.9
(0.035)
(0.36)
Soldering Terminal
Polarity
Push-button backlighting
LCD backlighting
Symbol backlighting
Front panel indicator
NOTE:
1. All dimensions are in millimeter (inches)
2. Tolerance is ± 0.1mm (.004") unless otherwise specified.
Absolute Maximum Ratings
@ T
A
=25 C
Parameter
Peak Forward Current
DC Forward Current
Power Dissipation
Reverse Voltage ( I
R
= 100
µA
)
Operating Temperature Range
Storage Temperature Range
Notes:
1. Derate linearly as shown in figure 4 for temperatures above 25
o
C
(1)
o
Symbol
I
FP
I
F
P
D
V
R
T
OPR
T
STG
Maximum Rating
80
25
65
5
-20 to + 80
-30 to + 100
Units
mA
mA
mW
V
o
o
C
C
Unity Opto Technology Co., Ltd.
12/11/2000
UOT [ UNITY OPTO TECHNOLOGY ]
